How SCIL technology works
Our technologies for enabling SCIL include the stamp’s top layer component of X-PDMS, which facilitates fine detail, low pressure imprinting. Low pressure and zero damage characteristics are further enhanced through a choice of patented sol-gel resists, applied by capillary action.
Nanometer resolution patterns are possible due to the tri-layer stamp construction.
Our X-PDMS (polydimethylsiloxane) top layer, which carries the nano/micro structure, is added to your chosen middle and bottom layers of soft PDMS and thin glass, respectively.
In this way, the stamp achieves conformal (full wafer contact) imprinting at low pressure. It is flexible enough to follow substrate unevenness while being rigid enough to create nanostructures without deformation. The X-PDMS is also soft enough for peel removing during sequential low force stamp release.
Our special patented inorganic sol-gel resist material is optically transparent, non-yellowing, low haze and UV and temperature stable. It can be used both as hard etch mask and as a functional layer.
- Good etch resistance: Directly patterned hard mask
- Good thermal stability: Directly patterned functional layers
- Highly reproducible, high quality imprints for maximum wafer efficiency
- Extended stamp lifetime; when used in combination with our patented sol-gels, stamps last for more then 500 imprint cycles without degradation